Comment by maven29

The technique you mention is very outdated and not used anymore. Current thin-bezel OLED panels (even on flexible substrate OLED) use a packaging technique which can be used in the exactly same way on rigid LCD panels. Folding the substrate with driver bonded is expensive, affects yields, and doesn't even get you the thinnest bezels

There are no LCD panels in recent phones that use COG packaging (chip-on-glass) for the display driver and run into the limitation you mentioned. Almost all current LCD phones will utitlize COF (chip-on-film) where the TFT array is attached to a flex-pcb which also contains the display driver.

You can achieve bezels just as thin or thinner using this technique, and Apple has used the technique you mention only once, COF is used even on flexible OLED panels.